Richard Tian

Computer Engineering, University of British Columbia to UW, 2019–2020 Corbett Recipient


My name is Richard Tian and I am a third-year computer engineering student at the University of British Columbia. I have a passion for tinkering around with electronics and developing apps that solve everyday problems.

Having lived in Vancouver almost my entire life, I have been to Seattle many times to shop, sightsee and indulge in crab boil. However, I still have an outsider’s view of the city, and I would really like to learn more about my southern neighbor. Residing in Seattle for a year will be a unique change of pace, and allow me to truly appreciate the different environment and vibrant culture.

The University of Washington is renowned for its prestigious School of Computer Science & Engineering, and will provide me with an enriched education unparalleled to that of UBC. I am especially interested in computer security, and I hope to take away learnings in this field to apply to my future work. Further, Seattle is a growing tech hub and I am enthusiastic about the many networking opportunities to grow my professional career.

Overall, I am incredibly honored and grateful to be a 2019–2020 Corbett scholar, and I look forward to this wonderful experience.

The Corbett British Columbia-Washington International Exchange Program Fund provides an opportunity for undergraduate students at the University of Washington to spend two semesters at the University of British Columbia or University of Victoria; and for students from the University of British Columbia and University of Victoria to spend three quarters at the University of Washington.